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Comparative first-principles molecular dynamics study of TiN(001)/SiN/TiN(001) and TiN(001)/SiC/TiN(001) interfaces in superhard nanocomposites

机译:TiN(001)/ SiN / TiN(001)和TiN(001)/ SiC / TiN(001)界面在超硬纳米复合材料中的比较第一性原理分子动力学研究

摘要

Heterostructures TiN(001)/SiN/TiN(001) and TiN(001)/SiC/TiN(001), with oneudmonolayer (ML) of interfacial SiN and SiC, respectively, inserted between five monolayerudthick B1-TiN, were investigated using first-principles quantum molecular dynamicsud(QMD) calculations. The temperature dependent QMD simulations at 300 K inudcombination with subsequent variable-cell structural relaxation revealed that theudTiN(001)/SiN/TiN(001) interface exists as pseudomorphic B1-SiN layer only at 0 K,udand as a superposition of distorted octahedral SiN6 and tetrahedral SiN4 units alignedudalong the (110) direction at a finite temperature. Thus, at 300 K, the interfacial layer isudnot epitaxial. Instead it consists of aggregates of the B1-SiN-like and Si3N4-like distortedudclusters. However, in the the TiN(001)/SiC/TiN(001) heterostructures, the interfacialudlayer remains epitaxial B1-SiC at 0 K as well as at 300 K, with only a small shift ofudnitrogen atoms on both sides of the interface towards the silicon atoms. A comparisonudwith the results obtained by earlier "static" ab initio DFT calculations at 0 K shows theudgreat advantage of the QMD calculations that allow us to reveal structural reconstructionsudcaused by thermal activation.When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/20546
机译:TiN(001)/ SiN / TiN(001)和TiN(001)/ SiC / TiN(001)的异质结构,分别在一个单层厚的B1-TiN之间插入一个单层(ML)的界面SiN和SiC,使用第一性原理量子分子动力学 ud(QMD)计算进行了研究。温度依赖于300 K的QMD模拟结合随后的可变单元结构弛豫表明 udTiN(001)/ SiN / TiN(001)界面仅在0 K处以伪晶B1-SiN层的形式存在。扭曲的八面体SiN6和四面体SiN4单元在有限温度下沿(110)方向排列/叠加。因此,在300 K下,界面层不是外延的。相反,它由B1-SiN类和Si3N4类扭曲团簇的聚集体组成。但是,在TiN(001)/ SiC / TiN(001)异质结构中,界面双分子层在0 K和300 K时仍为外延B1-SiC,而 N原子的两侧只有很小的位移与硅原子的界面。与早期的“静态”从头算起DFT计算在0 K下获得的结果进行比较显示了QMD计算的最大优点,它使我们能够揭示由于热活化而导致的结构重建。当您引用该文档时,请使用以下链接http://essuir.sumdu.edu.ua/handle/123456789/20546

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